FPC制程简介完整版.pptx

FPC製程簡介

1.ProductIntroduction2.FPC產品系列應用介紹1.1NOTEBOOK1.2LCDPANEL1.3PDA1.4CELLULARPHONE3.原材料介紹2.1銅箔2.2Coverlay2.3Stiffener2.4Adhesive2.5相關測試規範4.FPC標準製造作業流程介紹3.1單面板/雙面板3.2單面板雙層作法3.3浮雕線路3.4多層線路目錄

ProductIntroductionAdvantage體積小SmallSize重量輕LightWeight可折疊做3D立體安裝Flex-for-Installation可做動態撓屈DynamicFlexibilityApplicationNote-BookDigitalCameraDVD/CD-ROMHDDPrinterScannerPDACellularPhoneLCDAuto-Mobile

ApplicationForNootbookHingeCableDouble-sidedFPCImpedance50?5?60,000CyclesFlexureLifeEMIStrategyApplicationHingeCableDouble-sidedFPCImpedance50?5?60,000CyclesFlexureLifeCardbusDouble-sidedFPC100MHzTransferSpeedTouchPadDouble-sidedFPCSMTMounting

ApplicationForNootbook–CD/DVDROMDouble-sidedFPCStandardIDEInterfaceGroundingStrategyApplicationSingle-sidedFPCSpindleControlUnitSwitchPhotoSensorAppliedonFPCSingle-sidedFPC60,000CyclesFlexureLifeUltraThinMaterialDesign

ApplicationForLcdPanelLCMCableDouble-sidedFPCSMCMountingEMINoiseDepressionLCMCableDouble-sidedFPCSMCMountingACFLaminatingonFPCLCMCableDouble-sidedFPCFinePattern(L/S=1.6/1.8mil)ACFLaminatingonFPCHDDCableDouble-sidedFPC

ApplicationForPDASwitchBoardDouble-sidedFPCSMTMountingBatteryBoardSingle-sidedFPCSMCMountingHighCurrent-carriyngCapacity

ApplicationForCELLULARPHONEDouble-sidedFPC100,000CyclesFlexureLifeACFLaminatingonFPCDouble-sidedFPCBattery

RawMaterial-CCL相關名詞:CopperCladLaminates(銅薄基材)Single-Sided(單面銅薄基材)Double-Sided(雙面銅薄基材)CopperFoil:銅箔，銅皮

RA銅:壓延銅箔,輾壓方式。ED銅:電解銅箔,電鍍方式(Electrodeposited)。Polyimide(PI)聚亞醯胺:是一種由Bismaleimide與AromaticDiamine所共同聚合而成旳優良樹脂,杜邦企业將之做成片材，稱為Katpon。AdhesiveConductorDielectricSubstrateAdhesiveConductorDielectricSubstrate

DielectricSubstrateAdhesiveMylarAdhesiveKaptonRawMaterial-CVL

用途:1.補強軟板2.提供零件所需承載強度3.補償軟板厚度材質區分:PI/