0 bl7601mu3产品规格书wlan 11b g usb模块1 r7601mu3.pdfVIP

0 bl7601mu3产品规格书wlan 11b g usb模块1 r7601mu3.pdf

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B‐LINK

ELECTRONIC

CO.,

LTD

in

shenzhen

Contents

Contents

1

1:General

Description2

2:

The

range

of

applying2

3:Features

2

4:

DC

Characteristics…………….……3

5:

The

main

performance

of

product..

3

6:

DC/RF

characteristics

4

7:

The

block

diagram

of

product

principle5

8:

The

supported

platform

5

9:

The

definition

of

product

Pin

5

10:

The

Structure

and

Size

of

product6

11:Tpical

Solder

Reflow

Profil

7

1

B‐LINK

ELECTRONIC

CO.,

LTD

in

shenzhen

1.General

Description

BL‐R7601MU3

product

Accord

with

FCC

CE

is

a

highly

integrated

Wi‐Fi

single

chip

which

supports

150

Mbps

PHY

rate.

It

fully

complies

with

IEEE802.11n

and

IEEE802.11b/g

stands,

offering

feature‐rich

wireless

connectivity

at

high

standards,

and

delivering

reliable,

cost‐effective

throughput

from

an

extended

distance.

Optimized

RF

architecture

and

baseband

algorithms

provide

superb

performance

and

lower

power

consumption.

Intelligent

MAC

design

deploys

a

high

efficient

DMA

engine

and

hardware

data

processing

accelerators

which

offloads

the

host

processor.

BL‐R7601MU3

is

designed

to

support

standard

based

features

in

the

areas

of

security

quality

of

service

and

international

regulations,

giving

end

users

the

greatest

performance

anytime

and

in

any

circumstance.

2.The

range

of

applying

MID,

networking

camera,

STB

GPS,

E‐book,

Hard

disk

player,

Network

Radios,

PSP,

etc,

the

device

which

need

be

supported

by

wireless

networking.

3.Features

Feature

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