最全的芯片封装方式图文对照.doc

芯片封装方式大全 各种IC封装形式图片 BGABall Grid Array EBGA 680L LBGA 160L PBGA 217LPlastic Ball Grid Array  SBGA 192L TSBGA 680L CLCC CNRCommunication and Networking Riser Specification Revision 1.2  CPGACeramic Pin Grid Array DIPDual Inline Package  DIP-tabDual Inline Package with Metal Heatsink FBGA FDIP FTO220 Flat Pack HSOP28 ITO220 ITO3p JLCC LCC LDCC LGA LQFP PCDIP PGAPlastic Pin Grid Array PLCC \o "详细的物理尺寸" 详细规格 PQFP PSDIP LQFP 100L \o "详细的物理尺寸" 详细规格 METAL QUAD 100L \o "详细的物理尺寸" 详细规格 PQFP 100L \o "详细的物理尺寸" 详细规格 QFPQuad Flat Package SOT220 SOT223 SOT223 SOT23 SOT23/SOT323 SOT25/SOT353 SOT26/SOT363 SOT343 SOT523 SOT89 SOT89 Socket 603Foster LAMINATE TCSP 20LChip Scale Package TO252 TO263/TO268 SO DIMMSmall Outline Dual In-line Memory Module SOCKET 370For intel 370 pin PGA Pentium III & Celeron CPU SOCKET 423For intel 423 pin PGA Pentium 4 CPU SOCKET 462/SOCKET AFor PGA AMD Athlon & Duron CPU SOCKET 7For intel Pentium & MMX Pentium CPU QFPQuad Flat Package TQFP 100L SBGA SC-70 5L SDIP SIPSingle Inline Package SOSmall Outline Package 　 SOJ 32L SOJ SOP EIAJ TYPE II 14L SOT220 SSOP 16L SSOP TO18 TO220 TO247 TO264 TO3 TO5 TO52 TO71 TO72 TO78 TO8 TO92 TO93 TO99 TSOPThin Small Outline Package TSSOP or TSOP IIThin Shrink Outline Package uBGAMicro Ball Grid Array uBGAMicro Ball Grid Array 　 ZIPZig-Zag Inline Package TEPBGA 288L TEPBGA C-Bend Lead? CERQUADCeramic Quad Flat Pack \o "详细的物理尺寸" 详细规格 Ceramic Case LAMINATE CSP 112LChip Scale Package \o "详细的物理尺寸" 详细规格 Gull Wing Leads? LLP 8La \o "详细的物理尺寸" 详细规格 PCI 32bit 5VPeripheral Component Interconnect \o "详细的物理尺寸" 详细规格 PCI 64bit 3.3V PCMCIA PDIP PLCC \o "详细的物理尺寸" 详细规格 SIMM30Single In-line Memory Module SIMM72Single In-line Memory Module SIMM72Single In-line SLOT 1For intel Pentium II Pentium III & Celeron CPU SLOT AFor AMD Athlon CPU SNAPTK SNAPTK SNAPZP SOH 各种封 装 缩 写 说 明 BGA BQFP132 BGA BGA BGA BGA BGA CLCC CNR PGA DIP DIP-tab BGA DIP TO