各种包装材料简介.pptVIP

各種包裝材料簡介 目錄 一.內包裝材料 二.外包裝材料 三.出貨材料 四.其他材料 一:內包裝材料  1.CARRIER 1.SMD元器件所用包裝材料有:CARRIER TAPE,COVER TAPE,REEL 等. 1.1. CARRIER TAPE:根据EIA-481-B標准, CARRIER TAPE按其寬度可分為:8,12, 16,24,32,56,72~200等,其兩Pocket之 中心值即pitch值根据元器件寬度可取 8,12,16,20,24等. 1.2.8mm,12mm punched carrier tape dimensions(Figure1) 1.CARRIER TAPE 1.3. 8mm,12mm punched carrier tape dimensions requirements(Table 1) 1.4. Note1:The cavity defined by A0,B0 and T shall surround the component with sufficient clearance that: a) The component does not protrude be- yond either surface of the carrier tape. b) The component can be removed from the cavity in a vertical direction without mech- nical restriction ,after the top cover tape has been removed. 1.CARRIER TAPE 1.5. 8mm,12mm,16mm,24mm embossed carrier tape dimensions(Figure 2) and dimensions requirements(Table 2) 1.6. Note2::The cavity defined by A0,B0 and T shall surround the component with sufficient clearance that: a) Note 1 b) Rotation of the component is limited to 20o max for 8 and 12mm tapes, 1.CARRIER TAPE 10 o max for 16 and 24mm tapes c) Lateral movement of the component is restricted to 0.5mm max for 8 and 12mm wide tape, and to 0.1mm max for 16 and 24mm wide tape d) If S11.0mm, there may not be enough area for cover tape to be properly applied. 1.CARRIER TAPE 1.7.32,44,56~200mm embossed carrier tape dimensions(Figure 3,4),elongation and skew of sprocket holes, and all dimensions requirements(Table 3) 1.8. Note 3: a)Note 1 b)Lateral movement of the component is restricted to 1.0mm max 2.COVER TAPE 封裝帶(COVER TAPE)根據其特點可分為:熱敏性(HEAT SENSITIVE TAPE)和壓敏性(PRESSURE SENSITIVE) 1.熱敏性(HEAT SENSITIVE TAPE) 1.1.熱敏性封裝帶的主要結構組成:多層的薄膜復合而成(Figure 5) a.上下的塗層提供ESD保護