半导体封装 刷胶 汉高 WBC Capability in China.pdf

WBC Training Notes Wafer Backside Coating (WBC) Project: TWIR-7FPB92 Introduction and Capability Set-up in China Tony Winster , Ablestik U.K. Young XUE 21 June 2008 Sr. Technical Service Engineer July 15, 2008 Background Ablestik introduces a new line of specially designed adhesives that can be applied to the back of a wafer and dried. Conductive and nonconductive wafer backside coating materials have been developed for die sizes 3mm or less and enable such package types as COL, SO, TSOP and QFN. High thermal materials have been developed that are suitable for use in discrete and small power IC devices. The advantages of the wafer backside coating process are: * Bond line thickness and fillet formation can be controlled * Resin bleed is eliminated * Moisture resistance and adhesive strength are improved * WBC materials can achieve higher reliability levels 2 XUE Young WBC General Introduction and Capability Set-up in China WBC Process Introduction WBC Process Introduction 3 XUE Young WBC General Introduction and Capability Set-up in China WBC Process Overview WBC process utilizes existing downstream Die Attach infrastructure WBC process utilizes existing downstream Die Attach infrastructure and requires only standard, readily available printing machines. and requires only standard, readily available printing machines. 4 XUE Young WBC General Introduction and Capability Set-up in China WBC Merits -1 IC Application Lead frame standardization No need for dispensing ; glue is already on 100% of the ch