- 1、本文档共22页,可阅读全部内容。
- 2、原创力文档(book118)网站文档一经付费(服务费),不意味着购买了该文档的版权,仅供个人/单位学习、研究之用,不得用于商业用途,未经授权,严禁复制、发行、汇编、翻译或者网络传播等,侵权必究。
- 3、本站所有内容均由合作方或网友上传,本站不对文档的完整性、权威性及其观点立场正确性做任何保证或承诺!文档内容仅供研究参考,付费前请自行鉴别。如您付费,意味着您自己接受本站规则且自行承担风险,本站不退款、不进行额外附加服务;查看《如何避免下载的几个坑》。如果您已付费下载过本站文档,您可以点击 这里二次下载。
- 4、如文档侵犯商业秘密、侵犯著作权、侵犯人身权等,请点击“版权申诉”(推荐),也可以打举报电话:400-050-0827(电话支持时间:9:00-18:30)。
查看更多
NanoStar NanoFree 300 m Solder Bump (NanoStar NanoFree 300焊接凸点)
Application Report
SBVA017 - February 2004
NanoStar NanoFree 300m Solder Bump Wafer
Chip-Scale Package Application
Jim Rosson High Performance Analog—MAKE Packaging
ABSTRACT
The NanoStar Wafer Chip-Scale Package (WCSP) is a family of bare die packages
developed for applications that require the smallest possible package. WCSP provides
electrical interconnection via solder spheres attached to the die and is aligned with JEDEC
package standard MO−211[1]. NanoStar, with advanced materials engineering technology,
has demonstrated excellent board level reliability that allows it to be used without the need for
underfill adhesives, unlike conventional solder-bumped Flip Chip devices. This advanced
design allows standard, low-cost surface-mount technology (SMT) assembly processes to
be used successfully. This application guide provides the necessary design and reliability
information to apply the NanoStar 300µm solder bump packages.
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Package Offerings and Nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 Physical Description . . . . .
您可能关注的文档
- ModelPF 9000 REMANUFACTURED (模式9000 PF再生).pdf
- ModelPF 8000 REMANUFACTURED (模式8000 PF再生).pdf
- MODELS (V)B36, (V)B36I, (V)B36L, AND (V)B36LI(模型(V)B36 B36I(V),(V)B36L,B36LI(V)).pdf
- Modern Business Writing Fasset(现代商务写作Fasset).doc
- Modern Grandfather Clock Weights(现代的老爷钟的重量).pdf
- modern metal cutting a practical handbook (现代金属切削实用手册).pdf
- Modern precise highpower watercooling (现代精密大功率水冷).pdf
- MODIFIED CALCULATION METHOD OF (修改后的计算方法).pdf
- Modulation and Detection EOLSS(调制和检测EOLSS).pdf
- MODERN DIGITAL AND ANALOG (现代数字和模拟).pdf
文档评论(0)