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Photolithography - Wake Forest University(光刻-维克森林大学)
Photolithography
Source: Dr. R. B. Darling (UW)
lecture notes on photolithography
Why Lithography?
• Simple layers of thin films
do not make a device.
• To create a device such
as a transistor, layers of
thin films have to be
patterned, etched and
A MOSFET Device
coated.
• Lithography combines
these processes and can
create millions of devices
in batch. The MOSFET as patterned
on a wafer
What is Lithography?
• Lithography is the transfer of geometric shapes
on a mask to a smooth surface.
• The process itself goes back to 1796 when it
was a printing method using ink, metal plates
and paper.
• In modern semiconductor manufacturing,
photolithography uses optical radiation to
image the mask on a silicon wafer using
photoresist layers.
• Other methods are electron beam, scanning
probe, X-ray and XUV lithography.
Steps Used in Photolithography
• Surface cleaning
• Barrier layer formation (Oxidation)
• Spin coating with photoresist
• Soft baking
• Mask alignment
• Exposure
• Development
• Hard baking
• Post process cleaning
Wafer Cleaning - 1
• Typical contaminants that must be removed prior to
photoresist coating:
– dust from scribing or cleaving (minimized by laser scribing)
– atmospheric dust (minimized by good clean room practice)
– abrasive particles (from lapping or CMP)
– lint from wipers (minimized by using lint-free wipers)
– photoresist residue from previous photolithography (minimized
by performing oxygen plasma ashing)
– bacteria (minimized by good DI water system)
– films from other sources:
• solvent residue
• H O residue
2
• photoresist
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