90nm逻辑产品Peeling缺陷的解决方案.pdf

目 录 摘 要………………．…………………………………．．1 Abstract．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．3 引 言……………………………………………………．5 第一章光刻基本原理及概述··········································12 第一节光刻在集成电路中的应用·································12 第二节光刻基本原理···········································13 第三节光掩膜介绍·····················-·············-·········15 第四节光刻工艺介绍············································19 第二章光刻胶·····················································-22 第三章光刻设备及量测，缺陷检验设备································#25 第一节光刻设备···············································-25 第二节量测设备···············································．28 第三节缺陷检验设备···········································．29 第四章Thermal-wave及SIMS介绍····································．32 第一节Thermal-wave介绍········································32 第二节SIMS介绍···············································．33 第五章Peeling缺陷产生的现象和机理································36 第一节Peeling缺陷产生的现象···································36 第二节Peeling缺陷产生的机理··································37 第六章Peeling缺陷的解决方案······································40 第一节新光阻空片上Thermal-wave·······························42 curve······································．43 第二节新光阻swing 第三节新光阻空片上SIMS································-······44 第四节新光阻PRS和CDU········································．47 第五节新光阻ADI缺陷收集·····································49 第七章Sateliite缺陷产生的机理及解决方案···························5l 第一节Satellite缺陷产生的机理···························-·····51 第二节Satellite缺陷的解决方案································．52 第八章结论与展望··················································54 第一节结论····················································54 第二节展望····················································55 致谢·········0000000······················0000000··l Y1