Monitoring and Diagnosis in MES of Semiconductor Manufacturing with EXTRAKT.pdf

Monitoring and Diagnosis in MES of Semiconductor Manufacturing with EXTRAKT.pdf

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Monitoring and Diagnosis in MES of Semiconductor Manufacturing with EXTRAKT

MONITORING AND DIAGNOSIS IN MES OF SEMICONDUCTOR MANUFACTURING WITH “EXTRAKT” Klaus Kabitzsch 1 , Volodymyr Vasyutynskyy 1 , Gerolf Kotte 2 1 Faculty of Computer Science Dresden University of Technology, D-01062 Dresden, Germany Fax: ++49 351 463 38460, e-mail: {kk10, vv3}@inf.tu-dresden.de 2 SYSTEMA GmbH Manfred-von-Ardenne-Ring 6, D-01099 Dresden, Germany fax: ++49 351 882 4772, e-mail: gerolf.kotte@systemagmbh.de Abstract: The functionality of Manufacturing Execution Systems (MES) increases tremendously, integrating the modules with sophisticated control logic on different levels. That’s why the requirements on 7x24 reliability are much more important at the same time, when the facilities to verify the results decrease. In the presented paper a brief overview of existing problems and solutions in reliability is given. An á posteriori diagnosis based on assumptions about system behavior is described. The architecture and usage of diagnosis tool “Extrakt” is introduced. Copyright ? 2004 IFAC Keywords: fault diagnosis, manufacturing systems, event and sequence estimation 1. INTRODUCTION The semiconductor market experiences an immense turndown in the last years. The pressure on each manufacturer is high, the financial budget is low. To achieve advantages over the competitors, new products and technologies like 300mm wafer fabs were introduced along with quality improving and reducing of the time-to-market. As consequence a variety of hardware and as well as system-to-system interfaces software from different vendors exist for each shop floor automation (SFA) system. In the products now available the software integrates modules of Enterprise Resource Planning (ERP) on the higher abstraction level and of the Equipment Controller (EC) on the tool level. Additionally, the control logic becomes more sophisticated, for instance through Advanced Process Control (APC) and scheduling on wafer level. The trend of complexity increase goes on. The amount of information is beco

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