The Design and Fabrication of RF Band Pass Filter by LTCC Technology.pdf

The Design and Fabrication of RF Band Pass Filter by LTCC Technology Yuanxun Li1 1 1 1 1 2 ，Yingli Liu ，Huaiwu Zhang ，Dafu Lu , Lifei Bian ， Zongbao Yang 1State Key Laboratory of Electronic Thin Film and Integrated Devices, University of Electronic Science and Technology of China Chengdu, 610054, Sichuan, China 2Integrated microcircuit company of Anhui Province, Hefei, 230088, Anhui, China Abstract and 0.0015, respectively for 3D structure design of the chip LTCC (Low Temperature Co-fired Ceramics) has been BPF. The designed BPFs are fabricated by 33um thickness become the key technology of packaging for the integrated of films and constructed by LTCC technology with excellent RF passive components due to its higher performance of consistency between simulation and fabrication and merits of thermal sink, reliability and plays an important role in simple structures and low cost for wide applications. increasing higher frequency, decreasing the loss, minimize the volume, etc. This paper mainly focuses on the design and fabrication of RF band pass filter by LTCC technology. The Circuit and Stimulation filter model was established according to the capacitor A. Circuit Model coupled resonate band-pass filter’s circuit structure and the connect type of embedded coupling capacitor was neatly The BPFs were